半导体行业英文资讯

Teledyne Vision Solutions showcases advanced imaging technologies for semiconductor inspection at SEMICON Europa 2026. The post Teledyne Vision Solutions Demonstrates Single-Pass 300mm Wafer Inspection appeared first on Semiconductor Digest .

ViTrox will demonstrate a curated line-up of its flagship AI-driven inspection technologies, spanning front-end SMT assembly through to back-end semiconductor and advanced packaging. The post ViTrox Reports Nearly 200 AI-Powered X-Ray Inspection Systems Deployed appeared first on Semiconductor Digest .

German leader in photonic AI chips signs Memorandum of Understanding with Innovally and Horizon Flevoland at SEMICON Europa. The post Almere, Flevoland and Q.ANT Team Up for Computing with Light appeared first on Semiconductor Digest .

The tool will support advanced development and the expansion of manufacturing capacity for Aeluma’s non-indium-phosphide (non-InP) photonics platform. The post Aeluma Orders AIXTRON MOCVD System to Expand Photonics Manufacturing appeared first on Semiconductor Digest .

Thermo Fisher Scientific Inc. today announced that it has completed multiple installations of the Thermo Scientific Optis focused ion beam-scanning electron microscope (FIB-SEM). The post Thermo Fisher Scientific Reports Multiple Installations of Optis FIB-SEM Systems appeared first on Semiconductor Digest .

Automotive Chiplet Interoperability Requirement (ACIR) document complements existing standards by establishing a common set of architectural requirements for an open, multi-vendor automotive chiplet ecosystem. The post imec and ASRA Release Joint Architectural Requirements for Interoperable Automotive Chiplets appeared first on Semiconductor Digest .

The grant will support Texas Tech’s next-generation computing cluster as the university pushes and transforms semiconductor development. The post Texas Tech Receives $19 Million Grant to Further Semiconductor Innovation appeared first on Semiconductor Digest .

Researchers have solved a longstanding physics puzzle, explaining why electronic devices can fail catastrophically when exposed to radiation. Their findings may hold the key to engineering new electronics that can better withstand extreme environments, with applications ranging from nuclear energy to space exploration.

As electronic devices become smaller and more powerful, keeping them from overheating is an increasingly difficult engineering challenge. Now, Cornell researchers have developed a computational method, backed by the first experimental measurements of their kind, showing how an electric field can change the way a semiconductor conducts heat.

EPFL researchers have shown that a single organic semiconductor layer can drive either hydrogen or oxygen evolution, depending only on the molecular layer beneath it. Using this effect, they built the first organic semiconductor-based photocatalyst sheet that splits water using simulated sunlight with no applied bias.

What does a faint heartbeat have in common with a thunderous concert? Both present a challenge for digital technology: capturing the quietest details without losing the loudest sounds.

Technic will participate in SEMICON Europa 2026, taking place November 10–13, 2026, at Messe München in Munich, Germany. The post Technic Showcases Copper Plating Chemistries for Advanced Packaging appeared first on Semiconductor Digest .

Brewer Science, Inc. will be showcasing its latest innovations in material solutions enabling next-generation technology at SEMICON Europa 2026. The post Brewer Science to Showcase Advanced Materials Innovation at SEMICON Europa 2026 appeared first on Semiconductor Digest .

Driven by the European Chips Act and the trend toward localized semiconductor manufacturing, demand for materials, equipment, and technical services in Europe has attracted growing attention. The post Topco Scientific Establishes Dresden Hub, Makes SEMICON Europa Debut appeared first on Semiconductor Digest .

Sivers Semiconductors AB today announced a global distribution agreement with WT Microelectronics Co., Ltd., a world-leading electronics and semiconductors distributor. The post Sivers Semiconductors Announces Strategic Agreement with WT Microelectronics appeared first on Semiconductor Digest .

esmo group (esmo), a global supplier of manipulators, docking and interfacing components, and handling systems for the semiconductor industry, introduces Vulcon, a family of contactors developed for semiconductor final test. The post esmo Launches Vulcon Contactors for Semiconductor Final Test appeared first on Semiconductor Digest .

Sales grow by more than 18% to 166.7 million Euro in Q3 2026. The post Elmos Semiconductor Reports Double-Digit Revenue Growth in Q3 2026 appeared first on Semiconductor Digest .

This week at SEMICON Europa 2026, imec announced that it delivered the baseline flows for the silicon interposer platform being developed within the NanoIC pilot line. The post imec Advances Silicon Interposer Platform for European Chiplet Development appeared first on Semiconductor Digest .

Critical Manufacturing today announced new capabilities for its MES-powered Industrial Operations Platform, introducing a catalog of purpose-built AI agents that answer questions and build dashboards on the same governed data model that runs manufacturing execution. The post Critical Manufacturing Expands Industrial Operations Platform with Purpose-Built AI Agents appeared first on Semiconductor Digest .

Belgian semiconductor company ICsense reported a record year, with revenue rising 30% and profits increasing by more than 50%, driven in part by growing demand for custom chips used in brain-computer interfaces and implantable medical devices. The post ICsense Reports Record Growth as Demand Rises for Specialized Medical ASICs appeared first on Semiconductor Digest .

Finetech, a supplier of high-precision die bonding systems for advanced packaging and heterogeneous integration, is expanding its management team: André Thiemann became Co-CEO on November 1. The post Finetech Expands its Portfolio for Volume Production appeared first on Semiconductor Digest .

As advanced packaging plays an increasingly important role in the performance and miniaturization of electronic components, manufacturers face growing challenges in terms of yield, precision, and integration. The post Hummink Unveils the BIRD Module at SEMICON Europa 2026 appeared first on Semiconductor Digest .

Nordson Electronics Solutions accepted the 2026 Global Technology Award in the Plasma Systems category for their new, MARCH ExoSPHERE plasma treatment system. The post Nordson Electronics Solutions Wins The 2026 Global Technology Award for the MARCH ExoSPHERE Plasma Treatment System appeared first on Semiconductor Digest .

New capability delivers a 70% sulfuric acid recycle rate while maintaining stringent particle control; System validated across more than 50 process layers at a foundry customer. The post ACM Research Enhances Single-Wafer Hot SPM System with Sulfuric Acid Recycle Capability appeared first on Semiconductor Digest .

Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington state. The post Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D appeared first on Semiconductor Digest .

With Subfab NetZero, DAS Environmental Experts introduces a holistic approach to reducing emissions and operating costs. The new ALCEA waste gas abatement system for NOx treatment expands the company’s portfolio. The first installations are already in place at semiconductor manufacturers in Taiwan. The post The Next Level of Efficiency in Chip Manufacturing Is Taking Shape Below the Cleanroom appeared first on Semiconductor Digest .

CEA-Leti today launched SubFAB Labs, a joint program with International SubFAB Research Labs (ISRL) that gives the semiconductor industry a pre-industrial environment to test, validate and qualify technologies that reduce the environmental impact of chip manufacturing. The post CEA-Leti Launches SubFAB Labs with ISRL to Speed Adoption of Lower-Impact Chip Manufacturing Technologies appeared first on Semiconductor Digest .

Nvidia CEO Jensen Huang has admitted to having an affair, reportedly with a Chinese executive at a Singapore-based company that the United States suspects of smuggling AI microchips into China.

Infineon Technologies AG has successfully processed 300mm silicon carbide wafers into functional power devices at its fab in Villach, Austria. The post Infineon Processes Functional Power Devices on 300mm SiC Wafers appeared first on Semiconductor Digest .

At SEMICON Europa 2026, the Fraunhofer Institute for Photonic Microsystems IPMS will showcase current research results and technological developments for the semiconductor industry. The post Fraunhofer IPMS Highlights Semiconductor Technology Developments at SEMICON Europa appeared first on Semiconductor Digest .

New global competition invites university students to develop research and solutions addressing real-world semiconductor challenges. The post SEMI Foundation Launches Global Chip the Future Challenge appeared first on Semiconductor Digest .

HTEC research finds semiconductor companies are ahead in scaling AI, yet fragmented measurement is making it harder to connect engineering gains to business outcomes. The post Semiconductor Companies Get Tough on AI Investment, but Measuring Returns Remains a Challenge appeared first on Semiconductor Digest .

Mixx Technologies, Inc. today set out its view of high-density optical scale-up as a member of the Expanded Beam Optics Multi-Source Agreement (EBO MSA) and a contributing member of the Open CPX MSA. The post Mixx Technologies Backs Open Standards for Near-Package Optical Connectivity appeared first on Semiconductor Digest .