Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D

Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington state. The post Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D appeared first on Semiconductor Digest .